Session: 5H

Surface acoustic wave (SAW) technology has been featured in numerous publications for more than a decade because of the performance advantages and design flexibility. With the increasing of the frequency, the electrical effects become more important. The accurate prediction of the frequency response relies on a combination of good acoustic modeling techniques, rigorous die and package parasitic model. This paper provides a comprehensive methodology for the analysis and design of the RF SAW duplexer package. The Ansoft High Frequency Structure Simulator (HFSS), based on the finite element method (FEM), is used to model the duplexer package. The port definition in HFSS for the complex package structure is discussed. The die parasitics model is obtained by Agilent’s Momentum. Then we combine the die parasitics model with the resonators to get the die results. We assemble the package results and die results in Agilent’s Advanced Design System (ADS) to get the total response. Simulation and measurement results are compared and good agreement is found. Small insertion loss and high isolation in stop band are very important specifications in the SAW duplexer package design. Based on this methodology, several new ideas are proposed and improvements of the isolation can be achieved. The technique developed in this paper reduces the design cycle time significantly and can be applied to various RF SAW device packages.